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Because of its unique intermittent cutting and friction reversal characteristics, elliptical vibration cutting (EVC) has become the most promising method for machining of otherwise difficult-to-machine materials in recent years. However, some problems remain in the research towards development of EVC devices. In this paper, with the intention of solving the existing problems of EVC devices, a nonresonant-type EVC device that is driven by two parallel piezoelectric stacks is developed. After the principle of the device is introduced, the stiffness of the EVC device is calculated, and device simulations and experimental evaluations are performed. In addition, the performance of the EVC device is also tested. The experimental results show that the maximum strokes of the two directional mechanisms operating along the X- and Z-axes can reach 16.78 μm and 15.35 μm, respectively, and the motion resolutions in the X-axis and Z-axis directions both reach approximately 50 nm. Finally, a curved surface cutting experiment is carried out to verify the performance of the developed device

Development of nonresonant elliptical vibration cutting device based on parallel piezoelectric actuator