FEM thermal analysis of Cu/diamond/Cu and diamond/SiC heat spreaders | Zendy

Garuma Abdisa Denu | Zendy; Jibran Hussain Mirani | Zendy; Jiao Fu | Zendy; Zongchen Liu | Zendy; Hongxing Wang | Zendy

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FEM thermal analysis of Cu/diamond/Cu and diamond/SiC heat spreaders

Author(s) -

Garuma Abdisa Denu,

Jibran Hussain Mirani,

Jiao Fu,

Zongchen Liu,

Hongxing Wang

Publication year - 2017

Publication title -

aip advances

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.421

H-Index - 58

ISSN - 2158-3226

DOI - 10.1063/1.4978043

Subject(s) - diamond , materials science , heat spreader , copper , composite material , finite element method , carbide , heat sink , thermal , metallurgy , thermodynamics , physics

The effects of thermal stress resulting from thermal cooling in copper/diamond/copper heat spreader is investigated using finite element method. A similar model of diamond/SiC heat spreader is compared without addition of interlayer. The effect of carbide interlayer in reduction of interfacial thermal stress is investigated. The results show that the carbide interlayer film thickness is critical in stress reduction for a copper/diamond/copper heat spreader device. Diamond/SiC device has lower interfacial stress without interlayer. The study of mechanical and thermal property of diamond heat spreader is useful for optimal designs of efficient heat spreader for electronic components

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