Numerical simulation of fluid-structure interaction on flexible PCB with multiple ball grid array components
Author(s) -
Chong Hooi Lim,
M.Z. Abdullah,
Ishak Abdul Azid
Publication year - 2017
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.4976882
Subject(s) - ball grid array , deflection (physics) , fluent , printed circuit board , von mises yield criterion , wing , flexible electronics , structural engineering , ball (mathematics) , materials science , computer simulation , mechanical engineering , finite element method , computer science , composite material , engineering , simulation , electrical engineering , physics , optoelectronics , optics , mathematics , soldering , mathematical analysis
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