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Electroplated hard magnet layers with out-of-plane performance play important roles in electro-mechanical devices. We designed to improve magnetic performance of electroplated Co-based hard magnet layer via the enhancement of HCP(002) texture using a thin seed-layer whose HCP(002) texture is intrinsically high. The seed-layer is either CoP or CoNiMnP fixed at 1μm thickness. Top hard magnet layers CoNiP and CoP with varied thickness were electroplated on top of the seed-layer. The results indicate that the improvement in out-of-plane magnetic properties of top layer is 38% to 100% in Br, 13% to 100% in Hc and 57% to 300% in (BH)max due to introduction of the seed-layer. The evolution in texture coefficient of HCP(002) of the top layer was quantitatively studied. The resultant magnetic properties correlate well with the induced texture coefficient

Enhancement in (002) texture of electroplated Co-based hard magnet layers