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Enhancement in (002) texture of electroplated Co-based hard magnet layers
Author(s) -
Chi-Ju Hsiao,
Heng-Sheng Hsiao,
Chien-Yao Tseng,
Jen-Yuan Chang,
Cheng-Kuo Sung,
ShengChing Wang,
TsungShune Chin
Publication year - 2017
Publication title -
aip advances
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.421
H-Index - 58
ISSN - 2158-3226
DOI - 10.1063/1.4973941
Subject(s) - electroplating , magnet , texture (cosmology) , materials science , layer (electronics) , composite material , condensed matter physics , electrical engineering , computer science , physics , image (mathematics) , artificial intelligence , engineering
Electroplated hard magnet layers with out-of-plane performance play important roles in electro-mechanical devices. We designed to improve magnetic performance of electroplated Co-based hard magnet layer via the enhancement of HCP(002) texture using a thin seed-layer whose HCP(002) texture is intrinsically high. The seed-layer is either CoP or CoNiMnP fixed at 1μm thickness. Top hard magnet layers CoNiP and CoP with varied thickness were electroplated on top of the seed-layer. The results indicate that the improvement in out-of-plane magnetic properties of top layer is 38% to 100% in Br, 13% to 100% in Hc and 57% to 300% in (BH)max due to introduction of the seed-layer. The evolution in texture coefficient of HCP(002) of the top layer was quantitatively studied. The resultant magnetic properties correlate well with the induced texture coefficient

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