Open AccessComparison of epoxy-based encapsulating materials over temperature and strain rate
Author(s) -
Amnah Khan,
James Wilgeroth,
Jens Balzer,
William G. Proud
Publication year - 2017
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.4971680
Subject(s) - epoxy , thermosetting polymer , materials science , composite material , adhesive , strain rate , atmospheric temperature range , strain (injury) , syntactic foam , stress (linguistics) , aerospace , medicine , linguistics , philosophy , layer (electronics) , physics , meteorology , political science , law
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