Open AccessAdhesion strength study of sintered silver for power electronic devices application
Author(s) -
M. T. Asmah
Publication year - 2017
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.4968314
Subject(s) - materials science , porosity , composite material , soldering , shear strength (soil) , thermal conductivity , curing (chemistry) , electronic packaging , electrical resistivity and conductivity , material properties , direct shear test , adhesion , thermal grease , shear (geology) , electrical engineering , environmental science , soil science , soil water , engineering
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