Open AccessProcess parameters affecting the bonding of in-mold decoration of injection molded components
Author(s) -
Felix Woyan,
Matthias Bruchmüller,
Michael Koch
Publication year - 2016
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.177
H-Index - 75
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.4965459
Subject(s) - mold , materials science , factorial experiment , composite material , thermoplastic , design of experiments , die (integrated circuit) , thermal , computer science , statistics , physics , mathematics , machine learning , meteorology , nanotechnology
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