Open AccessOn twin density and resistivity of nanometric Cu thin films
Author(s) -
Katayun Barmak,
Xuan Liu,
Amith Darbal,
Noel T. Nuhfer,
Dooho Choi,
Tik Sun,
Andrew P. Warren,
Kevin R. Coffey,
Michael F. Toney
Publication year - 2016
Publication title -
journal of applied physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.699
H-Index - 319
eISSN - 1089-7550
pISSN - 0021-8979
DOI - 10.1063/1.4960701
Subject(s) - electrical resistivity and conductivity , crystal twinning , materials science , grain boundary , condensed matter physics , grain size , transmission electron microscopy , scattering , thin film , crystallography , mineralogy , microstructure , composite material , optics , chemistry , nanotechnology , physics , quantum mechanics
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