Open AccessShock induced damage in copper: A before and after, three-dimensional study
Author(s) -
David B. Menasche,
Jonathan Lind,
Shiu Fai Li,
Péter Kenesei,
J. F. Bingert,
U. Lienert,
Robert Suter
Publication year - 2016
Publication title -
journal of applied physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.699
H-Index - 319
eISSN - 1089-7550
pISSN - 0021-8979
DOI - 10.1063/1.4947270
Subject(s) - materials science , grain boundary , spall , crystal twinning , nondestructive testing , microstructure , shock (circulatory) , copper , composite material , metallurgy , physics , medicine , quantum mechanics
We report on the microstructural features associated with the formation of incipient spall and damage in a fully recrystallized, high purity copper sample. Before and after ballistic shock loading, approximately 0.8 mm3 of the sample's crystal lattice orientation field is mapped using non-destructive near-field High Energy Diffraction Microscopy. Absorption contrast tomography is used to imagevoids after loading. This non-destructive interrogation of damage initiation allows for novel characterization of spall points vis-a-vis microstructural features and a fully 3D examination of microstructural topology and its influence on incipient damage. The spalled region is registered with and mapped back onto the pre-shock orientation field. As expected, the great majority of voids occur at grain boundaries and higher order microstructural features; however, we find no statistical preference for particular grain boundary types. The damaged region contains a large volume of Σ–3 (60°⟨111⟩) connected domains with a large area fraction of incoherent Σ-3 boundaries