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Multilayer material characterization using thermographic signal reconstruction
Author(s) -
Steven M. Shepard,
Maria Frendberg Beemer
Publication year - 2016
Publication title -
aip conference proceedings
Language(s) - Uncategorized
Resource type - Conference proceedings
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.4940565
Subject(s) - thermography , nondestructive testing , signal (programming language) , thermal effusivity , logarithm , materials science , thermal diffusivity , logarithmic scale , characterization (materials science) , thermal , signal reconstruction , temperature measurement , diffusion , optics , acoustics , biological system , signal processing , computer science , infrared , electronic engineering , thermal resistance , thermodynamics , mathematical analysis , physics , mathematics , engineering , nanotechnology , biology , quantum mechanics , programming language , thermal contact conductance , digital signal processing

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