Open AccessEnhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels
Author(s) -
Mohamed T. Ghoneim,
Hossain M. Fahad,
Aftab M. Hussain,
Jhonathan P. Rojas,
Galo A. Torres Sevilla,
Nasir Alfaraj,
Ernesto Byas Lizardo,
Muhammad M. Hussain
Publication year - 2015
Publication title -
aip advances
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.421
H-Index - 58
ISSN - 2158-3226
DOI - 10.1063/1.4938101
Subject(s) - materials science , silicon , substrate (aquarium) , optoelectronics , electronics , transistor , cmos , crystalline silicon , engineering physics , nanotechnology , heat sink , electrical engineering , voltage , engineering , oceanography , geology
In today’s digital world, complementary metal oxide semiconductor (CMOS) technology enabled scaling of bulk mono-crystalline silicon (100) based electronics has resulted in their higher performance but with increased dynamic and off-state power consumption. Such trade-off has caused excessive heat generation which eventually drains the charge of battery in portable devices. The traditional solution utilizing off-chip fans and heat sinks used for heat management make the whole system bulky and less mobile. Here we show, an enhanced cooling phenomenon in ultra-thin (>10 μm) mono-crystalline (100) silicon (detached from bulk substrate) by utilizing deterministic pattern of porous network of vertical “through silicon” micro-air channels that offer remarkable heat and weight management for ultra-mobile electronics, in a cost effective way with 20× reduction in substrate weight and a 12% lower maximum temperature at sustained loads. We also show the effectiveness of this event in functional MOS field effect transistors (MOSFETs) with high-κ/metal gate stacks
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