Electromagnetic imaging through thick metallic enclosures
Author(s) -
Brendan J. Darrer,
Joseph C. Watson,
Paul A. Bartlett,
Ferruccio Renzoni
Publication year - 2015
Publication title -
aip advances
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.421
H-Index - 58
ISSN - 2158-3226
DOI - 10.1063/1.4928864
Subject(s) - enclosure , materials science , copper , acoustics , optics , computer science , physics , metallurgy , telecommunications
The ability to image through metallic enclosures is an important goal of any scanning technology for security applications. Previous work demonstrated the penetrating power of electromagnetic imaging through thin metallic enclosures, thus validating the technique for security applications such as cargo screening. In this work we study the limits of electromagnetic imaging through metallic enclosures, considering the performance of the imaging for different thicknesses of the enclosure. Our results show, that our system can image a Copper disk, even when enclosed within a 20 mm thick Aluminum box. The potential for imaging through enclosures of other materials, such as Lead, Copper, and Iron, is discussed
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