Open AccessKinetic studies of chemical shrinkage and residual stress formation in thermoset epoxy adhesives under confined curing conditions
Author(s) -
Melanie Schumann,
Paul Ludwig Geiß
Publication year - 2015
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.4918524
Subject(s) - thermosetting polymer , curing (chemistry) , materials science , epoxy , adhesive , rheometry , composite material , shrinkage , rheology , polymer , layer (electronics)
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