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We investigated the effects of the interface state density (DIT) at the interfaces between SiO2 and the Si-, C-, and a-faces of 4H-SiC in n-channel metal-oxide-semiconductor field-effect transistors that were subjected to dry/nitridation and pyrogenic/hydrotreatment processes. The interface state density over a very shallow range from the conduction band edge (0.00 eV < EC − ET) was evaluated on the basis of the subthreshold slope deterioration at low temperatures (11 K < T). The interface state density continued to increase toward EC, and DIT at EC was significantly higher than the value at the conventionally evaluated energies (EC − ET = 0.1–0.3 eV). The peak field-effect mobility at 300 K was clearly inversely proportional to DIT at 0.00 eV, regardless of the crystal faces and the oxidation/annealing processes

aip advances

N-channel field-effect mobility inversely proportional to the interface state density at the conduction band edges of SiO<sub>2</sub>/4H-SiC interfaces

N-channel field-effect mobility inversely proportional to the interface state density at the conduction band edges of SiO2/4H-SiC interfaces

N-channel field-effect mobility inversely proportional to the interface state density at the conduction band edges of SiO₂/4H-SiC interfaces