Conductive cooling in white organic light emitting diode for enhanced efficiency and life time
Author(s) -
Priyanka Tyagi,
Arunandan Kumar,
Lalat Indu Giri,
Suneet Tuli,
Ritu Srivastava
Publication year - 2015
Publication title -
applied physics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.182
H-Index - 442
eISSN - 1077-3118
pISSN - 0003-6951
DOI - 10.1063/1.4903800
Subject(s) - materials science , electrical conductor , diode , oled , optoelectronics , thermal management of electronic devices and systems , heat transfer , epoxy , dissipation , encapsulation (networking) , composite material , thermodynamics , mechanical engineering , computer network , physics , layer (electronics) , computer science , engineering
We demonstrate white organic light emitting diodes with enhanced efficiency (26.8 lm/W) and life time (∼11 000 h) by improved heat dissipation through encapsulation composed of a metal (Cu, Mo, and Al) and mica sheet joined using thermally conducting epoxy. Finite element simulation is used to find effectiveness of these encapsulations for heat transfer. Device temperature is reduced by about 50% with the encapsulation. This, consequently, has improved efficiency and life time by about 30% and 60%, respectively, with respect to glass encapsulation. Conductive cooling of device is suggested as the possible cause for this enhancement.
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