Fabrication of 5-20 nm thick β-W films
Author(s) -
Avyaya J. Narasimham,
Manasa Medikonda,
Akitomo Matsubayashi,
Prasanna Khare,
Hyuncher Chong,
R. J. Matyi,
Alain C. Diebold,
V. P. LaBella
Publication year - 2014
Publication title -
aip advances
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.421
H-Index - 58
ISSN - 2158-3226
DOI - 10.1063/1.4903165
Subject(s) - x ray photoelectron spectroscopy , tungsten , sputtering , materials science , substrate (aquarium) , fabrication , layer (electronics) , deposition (geology) , diffraction , sputter deposition , optoelectronics , electrical resistivity and conductivity , thin film , analytical chemistry (journal) , nanotechnology , optics , chemical engineering , metallurgy , chemistry , electrical engineering , alternative medicine , oceanography , pathology , engineering , biology , paleontology , chromatography , medicine , physics , sediment , geology
A technique to fabricate 5 to 20 nm thick sputter deposited β W films on SiO2 and Si substrates is presented. This is achieved by growing tungsten on a 5 nm SiO2 layer or in an oxygen controlled environment by flowing 2 sccm of O2 during deposition. Resistivity, X-ray photoelectron spectroscopy, X-ray diffraction and reflectivity studies were performed to determine the phase and thickness of tungsten films. These results demonstrate a technique to grow this film on bare Si or a SiO2 substrate, which can enable growth on the bottom of a write unit in a non-volatile spin logic device
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