Open AccessElectroplated Fe films prepared from a deep eutectic solvent
Author(s) -
T. Yanai,
Kazunori Shiraishi,
T. Shimokawa,
Yoichi Watanabe,
Takeshi Ohgai,
Masaki Nakano,
K. Suzuki,
Hideharu Fukunaga
Publication year - 2014
Publication title -
journal of applied physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.699
H-Index - 319
eISSN - 1089-7550
pISSN - 0021-8979
DOI - 10.1063/1.4870319
Subject(s) - electroplating , deep eutectic solvent , plating (geology) , eutectic system , materials science , ethylene glycol , choline chloride , deposition (geology) , metallurgy , current density , chemical engineering , analytical chemistry (journal) , chemistry , composite material , microstructure , chromatography , layer (electronics) , paleontology , physics , quantum mechanics , geophysics , sediment , engineering , biology , geology , biochemistry
Electroplating of Fe films was carried out from choline chloride-ethylene glycol types of DES (Deep Eutectic Solvent). We investigated magnetic properties of the plated Fe films and evaluated the productivity for the electroplating process. Consequently, we found that surface morphology and current efficiency of the plated films were affected by the bath temperature. We obtained the Fe films with relatively smooth surface and high current efficiency in the bath temperature range from 70 to 110°C. The deposition rate for our process depended on the current density, and we obtained high deposition rate value of approximately 120μm/h. We also obtained high current efficiency values of approximately 90% in the wide range of plating time. These results indicate that the DES-based bath has industrial advantages for mass-producing Fe films. Therefore, we conclude that the DES-based bath is an attractive plating bath for Fe films
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