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Quantification of residual stress from photonic signatures of fused silica
Author(s) -
K. Elliott Cramer,
Maurice E. Hayward,
William T. Yost
Publication year - 2014
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.177
H-Index - 75
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.4865025
Subject(s) - residual stress , stress (linguistics) , residual , photonics , materials science , photonic crystal , computer science , optoelectronics , composite material , algorithm , philosophy , linguistics
A commercially available grey-field polariscope (GFP) instrument for photoelastic examination is used to assess impact damage inflicted upon the outer-most pane of Space Shuttle windows made from fused silica. A method and apparatus for calibration of the stress-optic coefficient using four-point bending is discussed. The results are validated on known material (acrylic) and are found to agree with literature values to within 6%. The calibration procedure is then applied to fused-silica specimens and the stress-optic coefficient is determined to be 2.43 ± 0.54 × 10−12 Pa−1. Fused silica specimens containing impacts artificially made at NASA’s Hypervelocity Impact Technology Facility (HIT-F), to simulate damage typical during space flight, are examined. The damage sites are cored from fused silica window carcasses and examined with the GFP. The calibrated GFP measurements of residual stress patterns surrounding the damage sites are presented.

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