Patterned electrochemical deposition of copper using an electron beam | Zendy

Mark den Heijer | Zendy; I. Shao | Zendy; Alex Radisic | Zendy; M. C. Reuter | Zendy; Frances M. Ross | Zendy

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Patterned electrochemical deposition of copper using an electron beam

Author(s) -

Mark den Heijer,

I. Shao,

Alex Radisic,

M. C. Reuter,

Frances M. Ross

Publication year - 2014

Publication title -

apl materials

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 1.571

H-Index - 60

ISSN - 2166-532X

DOI - 10.1063/1.4863596

Subject(s) - nucleation , copper , materials science , electrochemistry , electron beam induced deposition , scanning electron microscope , deposition (geology) , chloride , electrode , transmission electron microscopy , electrolyte , focused ion beam , copper chloride , electron beam physical vapor deposition , inorganic chemistry , chemical engineering , metallurgy , ion , thin film , scanning transmission electron microscopy , nanotechnology , composite material , chemistry , paleontology , sediment , biology , organic chemistry , engineering

We describe a technique for patterning clusters of metal using electrochemical deposition. By operating an electrochemical cell in the transmission electron microscope, we deposit Cu on Au under potentiostatic conditions. For acidified copper sulphate electrolytes, nucleation occurs uniformly over the electrode. However, when chloride ions are added there is a range of applied potentials over which nucleation occurs only in areas irradiated by the electron beam. By scanning the beam we control nucleation to form patterns of deposited copper. We discuss the mechanism for this effect in terms of electron beam-induced reactions with copper chloride, and consider possible applications

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