Advanced liquid cooling in HCPVT systems to achieve higher energy efficiencies | Zendy

Severin Zimmermann | Zendy; Henning Helmers | Zendy; Manish K. Tiwari | Zendy; W. Escher | Zendy; Stephan Paredes | Zendy; P. T. Neves | Zendy; Dimos Poulikakos | Zendy; Maike Wiesenfarth | Zendy; Andreas W. Bett | Zendy; Bruno Michel | Zendy

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Advanced liquid cooling in HCPVT systems to achieve higher energy efficiencies

Author(s) -

Severin Zimmermann,

Henning Helmers,

Manish K. Tiwari,

W. Escher,

Stephan Paredes,

P. T. Neves,

Dimos Poulikakos,

Maike Wiesenfarth,

Andreas W. Bett,

Bruno Michel

Publication year - 2013

Publication title -

aip conference proceedings

Language(s) - English

Resource type - Conference proceedings

SCImago Journal Rank - 0.177

H-Index - 75

eISSN - 1551-7616

pISSN - 0094-243X

DOI - 10.1063/1.4822242

Subject(s) - heat sink , microchannel , exergy , photovoltaic system , materials science , thermal , computer cooling , nuclear engineering , process engineering , electrical engineering , mechanical engineering , computer science , engineering physics , electronic engineering , engineering , thermal management of electronic devices and systems , thermodynamics , physics , nanotechnology

The benefits of advanced thermal packaging are demonstrated through a receiver package consisting of a monolithic interconnected module (MIM) which is directly attached to a high performance microchannel heat sink. Those packages can be applied in high-concentration photovoltaic systems and the generated heat can be used in addition to the electrical power output (CPVT systems). Thus, the total energy efficiency of the system increases significantly. A detailed exergy analysis of the receiver power output underscores the advantages of the new cooling approach

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