Open AccessErratum: “Grain boundary diffusivity of Ni in Au thin films and the associated degradation in electrical contact resistance due to surface oxide film formation” [J. Appl. Phys. 113, 114906 (2013)]
Author(s) -
Nicolas Argibay,
Michael T. Brumbach,
Michael T. Dugger,
Paul G. Kotula
Publication year - 2013
Publication title -
journal of applied physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.699
H-Index - 319
eISSN - 1089-7550
pISSN - 0021-8979
DOI - 10.1063/1.4803125
Subject(s) - grain boundary , materials science , thermal diffusivity , contact resistance , oxide , thin film , condensed matter physics , electrical resistance and conductance , degradation (telecommunications) , composite material , metallurgy , nanotechnology , thermodynamics , layer (electronics) , physics , microstructure , electrical engineering , engineering
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