High temperature oxidation event of gelatin nanoskin-coated copper fine particles observed by in situ TEM
Author(s) -
Takashi Narushima,
Hiroki Tsukamoto,
Tetsu Yonezawa
Publication year - 2012
Publication title -
aip advances
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.421
H-Index - 58
ISSN - 2158-3226
DOI - 10.1063/1.4759498
Subject(s) - copper , gelatin , particle (ecology) , materials science , metal , slurry , in situ , particle size , nanoparticle , chemical engineering , analytical chemistry (journal) , metallurgy , chemistry , composite material , nanotechnology , chromatography , organic chemistry , engineering , oceanography , geology
Metallic copper fine particles were prepared using CuO slurry by hydrazine reduction in the presence of gelatin. To observe a behavior of these particles at high temperature, in situ heating TEM observations were carried out. Oxygen gas was introduced and the pressure of the TEM column was kept at 10^[-3] Pa, corresponding the pressure around the sample at 10^[-1] Pa. The gelatin, which acts as a protective nanoskin on the particle surface was gradually decomposed. Around approximately 140℃, it was observed that Cu2O dots formed on the surface of the copper particle. This result is well consistent with the behavior of the TG-DTA curve of the copper fine particles under ambient conditions, and provides key information of oxidative behavior of copper fine particles
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