Atomic layer deposited zinc tin oxide channel for amorphous oxide thin film transistors
Author(s) -
Jaeyeong Heo,
Sang Bok Kim,
Roy G. Gordon
Publication year - 2012
Publication title -
applied physics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.182
H-Index - 442
eISSN - 1077-3118
pISSN - 0003-6951
DOI - 10.1063/1.4752727
Subject(s) - amorphous solid , thin film transistor , materials science , atomic layer deposition , tin , tin oxide , zinc , thin film , equivalent oxide thickness , oxide , layer (electronics) , transistor , analytical chemistry (journal) , gate oxide , optoelectronics , nanotechnology , metallurgy , chemistry , electrical engineering , crystallography , engineering , voltage , chromatography
Bottom-gate thin film transistors with amorphous zinc tin oxide channels were grown by atomic layer deposition. The films maintained their amorphous character up to temperatures over 500 °C. The highest field effect mobility was ∼13 cm2/V·s with on-to-off ratios of drain current ∼109–1010. The lowest subthreshold swing of 0.27 V/decade was observed with thermal oxide as a gate insulator. The channel layers grown at 170 °C showed better transistor properties than those grown at 120 °C. Channels with higher zinc to tin ratio (∼3–4) also performed better than ones with lower ratios (∼1–3).
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