z-logo
open-access-imgOpen Access
Atomic layer deposited zinc tin oxide channel for amorphous oxide thin film transistors
Author(s) -
Jaeyeong Heo,
Sang Bok Kim,
Roy G. Gordon
Publication year - 2012
Publication title -
applied physics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.182
H-Index - 442
eISSN - 1077-3118
pISSN - 0003-6951
DOI - 10.1063/1.4752727
Subject(s) - amorphous solid , thin film transistor , materials science , atomic layer deposition , tin , tin oxide , zinc , thin film , equivalent oxide thickness , oxide , layer (electronics) , transistor , analytical chemistry (journal) , gate oxide , optoelectronics , nanotechnology , metallurgy , chemistry , electrical engineering , crystallography , engineering , voltage , chromatography
Bottom-gate thin film transistors with amorphous zinc tin oxide channels were grown by atomic layer deposition. The films maintained their amorphous character up to temperatures over 500 °C. The highest field effect mobility was ∼13 cm2/V·s with on-to-off ratios of drain current ∼109–1010. The lowest subthreshold swing of 0.27 V/decade was observed with thermal oxide as a gate insulator. The channel layers grown at 170 °C showed better transistor properties than those grown at 120 °C. Channels with higher zinc to tin ratio (∼3–4) also performed better than ones with lower ratios (∼1–3).

The content you want is available to Zendy users.

Already have an account? Click here to sign in.
Having issues? You can contact us here
Accelerating Research

Address

John Eccles House
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom