Opto-acoustic technique to evaluate adhesion strength of thin-film systems | Zendy

Sanichiro Yoshida | Zendy; Shiba P. Adhikari | Zendy; Kenji Gomi | Zendy; Ramesh Shrestha | Zendy; Daniel J. Huggett | Zendy; Chiaki Miyasaka | Zendy; I. Park | Zendy

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Opto-acoustic technique to evaluate adhesion strength of thin-film systems

Author(s) -

Sanichiro Yoshida,

Shiba P. Adhikari,

Kenji Gomi,

Ramesh Shrestha,

Daniel J. Huggett,

Chiaki Miyasaka,

I. Park

Publication year - 2012

Publication title -

aip advances

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.421

H-Index - 58

ISSN - 2158-3226

DOI - 10.1063/1.4719698

Subject(s) - materials science , wafer , michelson interferometer , interferometry , substrate (aquarium) , thin film , adhesion , transducer , optics , amplitude , interference (communication) , oscillation (cell signaling) , acoustics , optoelectronics , composite material , nanotechnology , computer science , physics , chemistry , computer network , channel (broadcasting) , oceanography , biochemistry , geology

An opto-acoustic technique is proposed to evaluate the adhesion strength of thin film systems at the film-substrate interface. The thin-film system to be examined is configured as an end-mirror of a Michelson interferometer, and driven from the rear with an acoustic transducer at audible frequencies. The amplitude of the resultant oscillation of the film is quantified as the variation in the contrast of the interferometric fringe pattern observed with a digital camera at 30 frames/s. As a proof of concept, experiment has been conducted with the use of a pair of strongly and weakly adhered Au-coated Si-wafer specimens. The technique successfully differentiates the adhesion strength of the specimens

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