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Internal stress and strain in heavily boron-doped diamond films grown by microwave plasma and hot filament chemical vapor deposition
Author(s) -
W. L. Wang,
M.C. Polo,
G. Sánchez,
J. Cifré,
J. Esteve
Publication year - 1996
Publication title -
journal of applied physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.699
H-Index - 319
eISSN - 1089-7550
pISSN - 0021-8979
DOI - 10.1063/1.362996
Subject(s) - chemical vapor deposition , boron , materials science , diamond , stress relaxation , grain boundary , stress (linguistics) , composite material , ultimate tensile strength , microstructure , nanotechnology , chemistry , creep , linguistics , philosophy , organic chemistry
The internal stress and strain in boron‐doped diamond films grown by microwave plasma chemical vapor deposition (MWCVD) and hot filament CVD (HFCVD) were studied as a function of boron concentration. The total stress (thermal+intrinsic) was tensile, and the stress and strain increased with boron concentration. The stress and the strain measured in HFCVD samples were greater than those of MWCVD samples at the same boron concentration. The intrinsic tensile stress, 0.84 GPa, calculated by the grain boundary relaxation model, was in good agreement with the experimental value when the boron concentration in the films was below 0.3 at.%. At boron concentrations above 0.3 at.%, the tensile stress was mainly caused by high defect density, and induced by a node‐blocked sliding effect at the grain boundar

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