Functional electroless gold Ohmic contacts in light emitting diodes | Zendy

P. Y. Chen | Zendy; HC Wong | Zendy; Shiyu Hu | Zendy; C.Y. Huang | Zendy; RuShi Liu | Zendy

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Functional electroless gold Ohmic contacts in light emitting diodes

Author(s) -

P. Y. Chen,

HC Wong,

Shiyu Hu,

C.Y. Huang,

RuShi Liu

Publication year - 2011

Publication title -

applied physics letters

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 1.182

H-Index - 442

eISSN - 1077-3118

pISSN - 0003-6951

DOI - 10.1063/1.3624831

Subject(s) - ohmic contact , gold plating (software engineering) , materials science , electroless plating , plating (geology) , light emitting diode , diode , electroless deposition , metallurgy , metallizing , optoelectronics , electrolyte , composite material , metal , electroplating , electrode , chemistry , layer (electronics) , management , geophysics , economics , geology

Conducting gold pads on light-emitting diodes chips are synthesized by electroless chemical deposition and exhibit no color difference, reliable ability of wire bonding, and high electrical conductivity. A plating electrolyte with a long life time and high stability is developed. The hardness of pads formed by electroless plating is three times softer than those formed by evaporation and the force gauge of the p- and n-pads yields of approximately 55 g. The mechanism of electroless gold plating is elucidated and the functions of chemical reagents are explained using the proposed model. The industrial application of electroless gold plating is feasible.

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