Open AccessInfluence of the Cu-Te composition and microstructure on the resistive switching of Cu-Te/Al2O3/Si cells
Author(s) -
L. Goux,
Karl Opsomer,
R. Degraeve,
Robert Müller,
Christophe Detavernier,
D. J. Wouters,
M. Jurczak,
L. Altimime,
J. A. Kittl
Publication year - 2011
Publication title -
applied physics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.182
H-Index - 442
eISSN - 1077-3118
pISSN - 0003-6951
DOI - 10.1063/1.3621835
Subject(s) - protein filament , microstructure , layer (electronics) , composition (language) , materials science , electrode , analytical chemistry (journal) , chemical composition , chemistry , crystallography , nanotechnology , composite material , chromatography , linguistics , philosophy , organic chemistry
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