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A model for including thermal conduction in molecular dynamics simulations
Author(s) -
Yue Wu,
Robert J. Friauf
Publication year - 1989
Publication title -
journal of applied physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.699
H-Index - 319
eISSN - 1089-7550
pISSN - 0021-8979
DOI - 10.1063/1.343221
Subject(s) - thermal conduction , thermal diffusivity , molecular dynamics , scaling , thermal , periodic boundary conditions , materials science , thermodynamics , thermal conductivity , mechanics , boundary value problem , statistical physics , chemistry , physics , computational chemistry , geometry , mathematics , quantum mechanics

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