Open AccessElectromigration in flip chip solder joints under extra high current density
Author(s) -
YanCheng Lin,
Jia-Hong Ke,
H. Y. Chuang,
Y. S. Lai,
C. R. Kao
Publication year - 2010
Publication title -
journal of applied physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.699
H-Index - 319
eISSN - 1089-7550
pISSN - 0021-8979
DOI - 10.1063/1.3371711
Subject(s) - electromigration , joule heating , current density , flip chip , current (fluid) , soldering , materials science , chip , joule effect , thermal copper pillar bump , optoelectronics , constant current , composite material , electrical engineering , physics , adhesive , layer (electronics) , quantum mechanics , engineering
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