Open AccessFabrication of an Antenna-Coupled Bolometer for Cosmic Microwave Background Polarimetry
Author(s) -
Kevin Denis,
N. Cao,
David T. Chuss,
Joseph R. Eimer,
J. Hinderks,
W.T. Hsieh,
S. H. Moseley,
Thomas R. Stevenson,
D.J. Talley,
K. U.-Yen,
Edward J. Wollack,
Betty Young,
Blas Cabrera,
Aaron Miller
Publication year - 2009
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.177
H-Index - 75
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.3292355
Subject(s) - bolometer , optoelectronics , transition edge sensor , microstrip , materials science , surface micromachining , wafer , microwave , wafer bonding , detector , microstrip antenna , fabrication , optics , antenna (radio) , electrical engineering , physics , medicine , alternative medicine , pathology , quantum mechanics , engineering
We describe the development of a detector for precise measurements of the cosmic microwave background polarization. The detector employs a waveguide to couple light between a pair of Mo/Au superconducting transition edge sensors (TES) and a feedhorn. Incorporation of an on‐chip ortho‐mode transducer (OMT) results in high isolation. The OMT is micromachined and bonded to the microstrip and TES circuits in a low temperature wafer bonding process. The wafer bonding process incorporates a buried superconducting niobium layer with a single crystal silicon layer which serves as the leg isolated TES membrane and as the microstrip dielectric. We describe the micromachining and wafer bonding process and report measurement results of the microwave circuitry operating in the 29–45 GHz band along with Johnson noise measurements of the TES membrane structures and development of Mo/Au TES operating under 100 mK.
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