Note: Anodic bonding with cooling of heat-sensitive areas | Zendy

Peter C. K. Vesborg | Zendy; Jakob L. Olsen | Zendy; Toke R. Henriksen | Zendy; Ib Chorkendorff | Zendy; Ole Hansen | Zendy

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Note: Anodic bonding with cooling of heat-sensitive areas

Author(s) -

Peter C. K. Vesborg,

Jakob L. Olsen,

Toke R. Henriksen,

Ib Chorkendorff,

Ole Hansen

Publication year - 2010

Publication title -

review of scientific instruments

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.605

H-Index - 165

eISSN - 1089-7623

pISSN - 0034-6748

DOI - 10.1063/1.3277117

Subject(s) - anodic bonding , borosilicate glass , silicon , materials science , anode , thermal conductivity , thermal , composite material , metallurgy , thermodynamics , electrode , chemistry , physics

Anodic bonding of silicon to glass always involves heating the glass and device to high temperatures so that cations become mobile in the electric field. We present a simple way of bonding thin silicon samples to borosilicate glass by means of heating from the glass side while locally cooling heat-sensitive areas from the silicon side. Despite the high thermal conductivity of silicon, this method allows a strong anodic bond to form just millimeters away from areas essentially at room temperature.

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