Open AccessApplication Of The SPV-based Surface Lifetime Technique To In-Line Monitoring Of Surface Cu Contamination
Author(s) -
John D’Amico,
Alexandre Savtchouk,
Matthew Wilson,
Chulhong Kim,
Hyung Won Yoo,
Chang Hwan Lee,
Tae Kyoung Kim,
Sang Hoon Son,
Erik M. Secula,
David G. Seiler,
Rajinder P. Khosla,
Dan Herr,
C. Michael Garner,
Robert McDonald,
Alain C. Diebold
Publication year - 2009
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.177
H-Index - 75
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.3251264
Subject(s) - metrology , wafer , contamination , materials science , production line , integrated circuit , line (geometry) , computer science , optoelectronics , optics , engineering , physics , mechanical engineering , mathematics , ecology , geometry , biology
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