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Detection of Metal Contamination on Silicon Wafer Backside and Edge by New TXRF Methods
Author(s) -
Hiroshi Kohno,
Motoyuki Yamagami,
Joseph Formica,
LiYong Shen,
Erik M. Secula,
David G. Seiler,
Rajinder P. Khosla,
Dan Herr,
C. Michael Garner,
Robert McDonald,
Alain C. Diebold
Publication year - 2009
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.177
H-Index - 75
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.3251262
Subject(s) - wafer , contamination , materials science , enhanced data rates for gsm evolution , silicon , lithography , semiconductor device , semiconductor , metrology , optoelectronics , nanotechnology , optics , computer science , layer (electronics) , ecology , telecommunications , biology , physics

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