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Water diffusion and fracture behavior in nanoporous low-k dielectric film stacks
Author(s) -
Han Li,
Ting Y. Tsui,
Joost J. Vlassak
Publication year - 2009
Publication title -
journal of applied physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.699
H-Index - 319
eISSN - 1089-7550
pISSN - 0021-8979
DOI - 10.1063/1.3187931
Subject(s) - nanoporous , materials science , dielectric , microelectronics , diffusion , low k dielectric , composite material , fracture (geology) , chemical engineering , nanotechnology , optoelectronics , engineering , physics , thermodynamics

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