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Improved contact for thermal and electrical transport in carbon nanofiber interconnects
Author(s) -
Tsutomu Saito,
Toshishige Yamada,
Drazen Fabris,
Hirohiko Kitsuki,
Patrick Wilhite,
Makoto Suzuki,
Cary Y. Yang
Publication year - 2008
Publication title -
applied physics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.182
H-Index - 442
eISSN - 1077-3118
pISSN - 0003-6951
DOI - 10.1063/1.2979710
Subject(s) - materials science , contact resistance , carbon nanofiber , electrical contacts , tungsten , deposition (geology) , electrode , current density , substrate (aquarium) , composite material , carbon fibers , optoelectronics , carbon nanotube , metallurgy , chemistry , paleontology , physics , oceanography , layer (electronics) , quantum mechanics , sediment , composite number , biology , geology
We study the performance and reliability of carbon nanofiber (CNF) interconnects under high-current stress by examining CNF breakdown for four test configurations, suspended/supported with/without tungsten deposition. The use of W is to improve the CNF-electrode contact. The supported cases show a larger current density just before breakdown than the suspended ones, suggesting an effective heat dissipation to the substrate. The W-deposited contacts reduce the initial total resistance from megaohm range without W to kilo-ohms. High-current stress does not change the total resistance of the test structures with W unlike those without W deposition.

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