Open AccessReduction of thermal conductivity in wafer-bonded silicon
Author(s) -
Z. L. Liau,
LR Danielson,
Patrick M. Fourspring,
Shuangqi Hu,
Gang Chen,
G. W. Turner
Publication year - 2008
Publication title -
applied physics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.182
H-Index - 442
eISSN - 1077-3118
pISSN - 0003-6951
DOI - 10.1063/1.2959063
Subject(s) - wafer , thermal conductivity , materials science , wafer dicing , wafer bonding , thermal conduction , silicon , polishing , anodic bonding , composite material , conductivity , optoelectronics , planar , chemistry , computer graphics (images) , computer science
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