LOW TEMPERATURE HEAT TRANSFER PROPERTIES OF CONVENTIONAL ELECTRICAL INSULATION FOR THE NEXT EUROPEAN DIPOLE | Zendy

J. Poliński | Zendy; Simon Canfer | Zendy; G. Ellwood | Zendy; Bertrand Baudouy | Zendy; J. G. Weisend | Zendy; John Barclay | Zendy; Susan Breon | Zendy; Jonathan Demko | Zendy; Michael DiPirro | Zendy; J. Patrick Kelley | Zendy; Peter Kittel | Zendy; Arkadiy Klebaner | Zendy; Al Zeller | Zendy; Mark Zagarola | Zendy; Steven Van Sciver | Zendy; Andrew Rowe | Zendy; John Pfotenhauer | Zendy; Tom Peterson | Zendy; Jennifer Lock | Zendy

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LOW TEMPERATURE HEAT TRANSFER PROPERTIES OF CONVENTIONAL ELECTRICAL INSULATION FOR THE NEXT EUROPEAN DIPOLE

Author(s) -

J. Poliński,

Simon Canfer,

G. Ellwood,

Bertrand Baudouy,

J. G. Weisend,

John Barclay,

Susan Breon,

Jonathan Demko,

Michael DiPirro,

J. Patrick Kelley,

Peter Kittel,

Arkadiy Klebaner,

Al Zeller,

Mark Zagarola,

Steven Van Sciver,

Andrew Rowe,

John Pfotenhauer,

Tom Peterson,

Jennifer Lock

Publication year - 2008

Publication title -

aip conference proceedings

Language(s) - English

Resource type - Conference proceedings

SCImago Journal Rank - 0.177

H-Index - 75

eISSN - 1551-7616

pISSN - 0094-243X

DOI - 10.1063/1.2908544

Subject(s) - epoxy , materials science , composite material , pipe insulation , superfluid helium 4 , heat transfer , thermal insulation , liquid helium , perpendicular , glass fiber , vacuum insulated panel , helium , thermodynamics , chemistry , physics , geometry , mathematics , layer (electronics) , organic chemistry

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