Thermal transport across nanoscale solid-fluid interfaces
Author(s) -
Sohail Murad,
Ishwar K. Puri
Publication year - 2008
Publication title -
applied physics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.182
H-Index - 442
eISSN - 1077-3118
pISSN - 0003-6951
DOI - 10.1063/1.2905281
Subject(s) - phonon , nanoscopic scale , thermal resistance , materials science , interfacial thermal resistance , thermal , heat flux , molecular dynamics , interface (matter) , thermal conductivity , chemical physics , heat transfer , mechanics , thermodynamics , condensed matter physics , nanotechnology , composite material , chemistry , physics , capillary number , capillary action , computational chemistry
An explanation for the effective thermal resistance RK can be based on the impedance to the passage of thermal phonons across an interface. We conjecture that (1) increasing the fluid pressure, and (2) making an interface more hydrophilic should facilitate better acoustic matching and thus lower RK. Our molecular dynamics simulations confirm this. Overall, RK decreases with increasing temperature and is inversely proportional to the heat flux.
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