Open AccessA Method for Precise TEM Sample Preparation Using the FIB Ex-Situ Lift-Out Technique with a Modified Copper Ring in Semiconductor Devices
Author(s) -
Jen-Lang Lue,
Tzu-Wei Chang,
J. C. Chen,
T. Wang,
David G. Seiler,
Alain C. Diebold,
Robert McDonald,
C. Michael Garner,
Dan Herr,
Rajinder P. Khosla,
Erik M. Secula
Publication year - 2007
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.177
H-Index - 75
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.2799426
Subject(s) - materials science , focused ion beam , transmission electron microscopy , sample preparation , copper , semiconductor , semiconductor device fabrication , sample (material) , in situ , optoelectronics , nanotechnology , ion , metallurgy , chromatography , chemistry , physics , quantum mechanics , meteorology , wafer
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