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Sequential thermal treatments of SiC in NO and O2: Atomic transport and electrical characteristics
Author(s) -
G. V. Soares,
I. J. R. Baumvol,
Leonie Hold,
F. Kong,
Ji Sheng Han,
Sima Dimitrijev,
C. Radtke,
F. C. Stedile
Publication year - 2007
Publication title -
applied physics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.182
H-Index - 442
eISSN - 1077-3118
pISSN - 0003-6951
DOI - 10.1063/1.2763966
Subject(s) - x ray photoelectron spectroscopy , annealing (glass) , materials science , dielectric , analytical chemistry (journal) , silicon carbide , thermal , silicon , capacitance , optoelectronics , chemistry , chemical engineering , electrode , composite material , thermodynamics , physics , chromatography , engineering
Sequential thermal oxidations and oxynitridations of SiC were performed using 18O2 and NO. The resulting films were characterized by x-ray photoelectron spectroscopy, ion beam analyses, and capacitance-voltage measurements. The best electrical characteristics were obtained from films directly grown in NO. A subsequent oxidation in O2 degraded the interface due to negative flatband-voltage shift, removal of N, and formation of C compounds, while a further annealing in NO brought the flatband shift in the C-V curves to rather moderate figures. This shift is related to competitive processes taking place during dielectric film formation which are discussed.No Full Tex

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