AI Assistant
Blog
Pricing
Log In
Sign Up
Erratum: “Thermomigration in flip-chip SnPb solder joints under alternate current stressing” [Appl. Phys. Lett. 90, 152105 (2007)]
Details
Cite
Export
Add to List
The content you want is available to Zendy users.
Already have an account? Click
here.
to sign in.
