Open AccessErratum: “Thermomigration in flip-chip SnPb solder joints under alternate current stressing” [Appl. Phys. Lett. 90, 152105 (2007)]
Author(s) -
HsiangYao Hsiao,
Chih Chen
Publication year - 2007
Publication title -
applied physics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.182
H-Index - 442
eISSN - 1077-3118
pISSN - 0003-6951
DOI - 10.1063/1.2748851
Subject(s) - flip chip , soldering , materials science , current (fluid) , chip , optoelectronics , condensed matter physics , nanotechnology , composite material , electrical engineering , engineering , physics , layer (electronics) , adhesive
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