Current effects on neck growth in the sintering of copper spheres to copper plates by the pulsed electric current method | Zendy

James M. Frei | Zendy; Umberto AnselmiTamburini | Zendy; Zuhair A. Munir | Zendy

Open Access

Current effects on neck growth in the sintering of copper spheres to copper plates by the pulsed electric current method

Author(s) -

James M. Frei,

Umberto AnselmiTamburini,

Zuhair A. Munir

Publication year - 2007

Publication title -

journal of applied physics

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.699

H-Index - 319

eISSN - 1089-7550

pISSN - 0021-8979

DOI - 10.1063/1.2743885

Subject(s) - sintering , electromigration , copper , materials science , void (composites) , electric current , current (fluid) , current density , evaporation , direct current , electrical current , composite material , metallurgy , electrical engineering , voltage , thermodynamics , engineering , physics , quantum mechanics

The effect of a pulsed dc on the sintering of copper spheres to copper plates was investigated. It was shown that the current had a marked effect on neck growth between the spheres and the plates. The enhancement of sintering under the effect of the current was attributed to electromigration. Microstructural observations on fracture surfaces of necks formed under high currents showed considerable void formation. It was also observed that the current resulted in increased evaporation and the formation of bunched evaporation steps. Formation of these steps and their location relative to the neck were consistent with current density distributions. The results of this investigation provide direct evidence for the role of the current in the sintering in the pulse electric current sintering method.

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