Thermionic cooling in cylindrical semiconductor nanostructures | Zendy

Pin Lyu | Zendy; Chao Zhang | Zendy

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Thermionic cooling in cylindrical semiconductor nanostructures

Author(s) -

Pin Lyu,

Chao Zhang

Publication year - 2006

Publication title -

applied physics letters

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 1.182

H-Index - 442

eISSN - 1077-3118

pISSN - 0003-6951

DOI - 10.1063/1.2361263

Subject(s) - thermionic emission , materials science , thermal conduction , optoelectronics , semiconductor , electrode , cylinder , semiconductor device , voltage , phonon , electron , condensed matter physics , nanotechnology , chemistry , physics , composite material , mechanical engineering , layer (electronics) , quantum mechanics , engineering

The authors analyzed the thermionic cooling efficiency of the cylindrical semiconductor nanostructures. It is shown that due to the reduced emission current from the inner electrode, the cooling efficiency can be enhanced if the outer cylinder is the cold electrode. The threshold voltage for thermionic cooling is lower in cylindrical devices as compared to that in planar devices. The competition between the heat transport by electrons and the heat conduction by phonons is responsible for the efficiency enhancement and the voltage reduction.

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