Open AccessChemistry of Cu deposition by Cu(hfac)(tmvs) monitored by Li+ ion attachment mass spectrometry
Author(s) -
Toshihiro Fujii,
Sundaram Arulmozhiraja,
Megumi Nakamura,
Yoshiro Shiokawa
Publication year - 2006
Publication title -
journal of applied physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.699
H-Index - 319
eISSN - 1089-7550
pISSN - 0021-8979
DOI - 10.1063/1.2360768
Subject(s) - chemistry , mass spectrometry , ion , analytical chemistry (journal) , chemical vapor deposition , copper , deposition (geology) , adduct , environmental chemistry , organic chemistry , chromatography , paleontology , sediment , biology
This work was supported in part by The New Energy and Industrial Technology Development Organization NEDO under a fund for Fundamental Technology Research Facilitation Program.
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom