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Fluorine-vacancy complexes in ultrashallow B-implanted Si
Author(s) -
D. A. Abdulmalik,
P. G. Coleman,
N. E. B. Cowern,
Andrew J. Smith,
B.J. Sealy,
W. Lerch,
S. Paul,
F. Cristiano
Publication year - 2006
Publication title -
applied physics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.182
H-Index - 442
eISSN - 1077-3118
pISSN - 0003-6951
DOI - 10.1063/1.2335594
Subject(s) - boron , vacancy defect , ion implantation , isothermal process , fluorine , ion , positron annihilation spectroscopy , deep level transient spectroscopy , wafer , materials science , secondary ion mass spectrometry , analytical chemistry (journal) , spectroscopy , mass spectrometry , silicon , radiochemistry , chemistry , positron , crystallography , positron annihilation , nanotechnology , optoelectronics , metallurgy , thermodynamics , physics , nuclear physics , organic chemistry , chromatography , quantum mechanics , electron
Shallow fluorine-vacancy (FV) complexes in Si have been directly observed using variable-energy positron annihilation spectroscopy and secondary ion mass spectrometry. The FV complexes, introduced to combat the deactivation and transient-enhanced diffusion of ultrashallow boron, were observed in preamorphized Si wafers implanted with 0.5keV B and 10keV F ions at a dose of 1015cm−2, and then annealed isothermally at 800°C for times ranging from 1to2700s. The results are in agreement with a model which predicts that the complexes are of the form F3nVn, with n most probably being 1 and/or 2.

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