Open AccessCharacterizing Via Bottom Integrity in Cu/Low-κ Processes
Author(s) -
C. C. Martner
Publication year - 2005
Publication title -
aip conference proceedings
Language(s) - Uncategorized
Resource type - Conference proceedings
SCImago Journal Rank - 0.177
H-Index - 75
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.2063007
Subject(s) - fabrication , materials science , deposition (geology) , etching (microfabrication) , absorption (acoustics) , structural integrity , optoelectronics , copper interconnect , composite material , geology , structural engineering , medicine , paleontology , alternative medicine , pathology , layer (electronics) , sediment , engineering , dielectric
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