High-resolution three-dimensional imaging of flat objects by synchrotron-radiation computed laminography

Computed laminography with synchrotron radiation is developed and carried out for three-dimensional imaging of flat, laterally extended objects with high spatial resolution. Particular experimental conditions of a stationary synchrotron source have been taken into account by a scanning geometry different from that employed with movable conventional laboratory x-ray sources. Depending on the mechanical precision of the sample manipulation system, high spatial resolution down to the scale of 1 µm can be attained nondestructively, even for objects of large lateral size. Furthermore, high beam intensity and the parallel-beam geometry enables easy use of monochromatic radiation for optimizing contrast and reducing imaging artifacts. Simulations and experiments on a test object demonstrate the feasibility of the method. Application to the inspection of solder joints in a flip-chip bonded device shows the potential for quality assurance of microsystem devices