Erratum∕Apology: Wafer-bonded semiconductors using In∕Sn and Cu∕Ti metallic interlayers [Appl. Phys. Lett. 84, 3504 (2004)]
Author(s) -
Frank F. Shi,
Hao Chen,
Scott MacLaren
Publication year - 2004
Publication title -
applied physics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.182
H-Index - 442
eISSN - 1077-3118
pISSN - 0003-6951
DOI - 10.1063/1.1789571
Subject(s) - wafer , materials science , semiconductor , metal , optoelectronics , nanotechnology , condensed matter physics , metallurgy , physics
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