Practical Fab Applications of X-ray Metrology | Zendy

Dileep Agnihotri | Zendy

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Practical Fab Applications of X-ray Metrology

Author(s) -

Dileep Agnihotri

Publication year - 2003

Publication title -

aip conference proceedings

Language(s) - English

Resource type - Conference proceedings

SCImago Journal Rank - 0.177

H-Index - 75

eISSN - 1551-7616

pISSN - 0094-243X

DOI - 10.1063/1.1622542

Subject(s) - metrology , reflectometry , x ray reflectivity , materials science , wafer , optics , throughput , surface finish , nanotechnology , computer science , physics , thin film , metallurgy , time domain , telecommunications , wireless , computer vision

X‐ray metrology techniques have emerged from the laboratory to meet the challenges of the production fab. X‐ray Reflectometry (XRR) and X‐ray Fluorescence (XRF) are non‐destructive methods to probe film thickness, density, roughness, and composition. What has kept x‐ray metrology out of the fab for so long is large spot size, low throughput, and difficult analysis. Combining small‐spot XRR and XRF techniques, today’s x‐ray metrology covers a wide range of applications from front‐end to back‐end, transparent to metal, ultrathin to micron‐thick, on blanket and patterned wafers with speed and with automated data analysis. This work focuses on copper barrier applications.

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