Open AccessThermal stress at wafer contact points in rapid thermal processing investigated by repeated spike treatment before oxidation
Author(s) -
ChaoChi Hong,
Chang-Yun Chang,
Chaung-Yuan Lee,
JennGwo Hwu
Publication year - 2003
Publication title -
journal of applied physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.699
H-Index - 319
eISSN - 1089-7550
pISSN - 0021-8979
DOI - 10.1063/1.1539536
Subject(s) - wafer , materials science , oxide , annealing (glass) , rapid thermal processing , silicon , thermal oxidation , quartz , stress (linguistics) , thermal , composite material , thermal treatment , analytical chemistry (journal) , metallurgy , chemistry , optoelectronics , thermodynamics , linguistics , philosophy , physics , chromatography
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